发明名称 ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 <p>Provided is an acoustic wave device that allows the film thickness of an IDT electrode to be made thicker while suppressing unwanted wave responses. The acoustic wave device is equipped with: a piezoelectric substrate (2); an IDT electrode (3) containing multiple electrode fingers arranged in a line on the piezoelectric substrate (2); a first dielectric film (4) formed between the multiple electrode fingers; a second dielectric film (7) covering the IDT electrode (3) and the first dielectric film (4); and a high-velocity layer (5), which is a medium with a higher velocity than the first dielectric film (4), and which is formed between the multiple electrode fingers on the first dielectric layer (4).</p>
申请公布号 WO2011105317(A1) 申请公布日期 2011.09.01
申请号 WO2011JP53631 申请日期 2011.02.21
申请人 TAIYO YUDEN CO.,LTD.;MIURA ,MICHIO;WARASHINA ,SUGURU;MATSUDA ,TAKASHI;MATSUDA ,SATORU;INOUE ,KAZUNORI 发明人 MIURA ,MICHIO;WARASHINA ,SUGURU;MATSUDA ,TAKASHI;MATSUDA ,SATORU;INOUE ,KAZUNORI
分类号 H03H9/145;H03H3/08;H03H9/64 主分类号 H03H9/145
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