| 摘要 |
PROBLEM TO BE SOLVED: To provide a dividing processing apparatus having a means for confirming chipping on a rear surface of a wafer which has been cut. SOLUTION: The dividing processing apparatus is used to dividedly process a wafer arranged, via a dicing tape, on an annular frame having an opening portion for housing the wafer. The apparatus includes: a processing chuck table for holding the wafer in dividing processing, a processing means for dividedly processing the wafer held on the processing chuck table, an image pickup chuck table having a transparent holding portion for holding the dividedly processed wafer, a rear surface image pickup means for picking up an image of the wafer held on the transparent holding portion of the image pickup chuck table from the rear surface over the transparent holding means, and a conveying means for conveying the dividedly processed wafer while holding the annular frame from the processing chuck table to the image pickup chuck table. COPYRIGHT: (C)2011,JPO&INPIT |
