| 摘要 |
PROBLEM TO BE SOLVED: To solve the following problems: it is difficult to complete effective bonding as a top width of a wiring pattern becomes smaller than a bottom width owing to an undercut made since etching advances anisotropically in a conventional wet etching process; and it is difficult to achieve bonding to a semiconductor chip in a state where wiring is hollowed and formed in a device hole since a lead becomes deficient in strength owing to the decrease in the top width caused by the undercut. SOLUTION: A conductor foil stuck on one surface of an insulating substrate having the device hole is pattern-processed by wet etching using an etchant to which an inhibitor is added to make the top width wider than the bottom width, and a bottom side is caused to stick into an electrode pad of the semiconductor chip, thereby achieving secure bonding to the electrode pad on an insulating substrate side in the device hole. Further, when the semiconductor chip is mounted, the semiconductor chip is arranged to be stored in the device hole, so that a package can be made thin. COPYRIGHT: (C)2011,JPO&INPIT |
