发明名称 HEAT SHIELD
摘要 PROBLEM TO BE SOLVED: To improve cooling of a high temperature gas path component by coupling a base layer and a spacer layer with the high temperature gas path component. SOLUTION: The heat shield 100 includes the base layer 102 and the spacer layer 101. The spacer layer 101 is connected to the base layer 102. The spacer layer 101 defines a plurality of passages 49. The base layer 102 and the spacer layer 101 are configured to be coupled with the high temperature gas path component 34. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011163344(A) 申请公布日期 2011.08.25
申请号 JP20110022348 申请日期 2011.02.04
申请人 GENERAL ELECTRIC CO 发明人 ITZEL GARY MICHAEL;MORGAN VICTOR JOHN
分类号 F01D9/02;F01D25/08;F01D25/12;F02C7/18;F02C7/24 主分类号 F01D9/02
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