CORE AND WAFER MACHINING TAPE WOUNDED AROUND THE CORE

摘要

PURPOSE: A core and a wafer processing tape wound around the core are provided to suppress a transfer mark in an adhesive layer by winding the wafer processing tape including dicing and die-bonding films with a roll shape. CONSTITUTION: An adhesive layer(32) is installed on the surface of a release film. A label unit(33a) is contacted with a release film around the adhesive layer. A peripheral unit(33b) surrounds the outside of the label unit. A reducing unit(11) corresponds to the adhesive layer and reduces the winding pressure. A support unit(12) is formed on the outer side of the reducing unit and supports the wafer processing tape.