| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor chip with an adhesive layer that attains high reliability of a semiconductor device by suppressing flotation and chipping of an adhesive layer caused at an end of the semiconductor chip during dicing and contamination of the adhesive layer caused during pickup operation. SOLUTION: The method of manufacturing the semiconductor chip with the adhesive layer used for flip-chip mounting includes the processes of: forming the adhesive layer so that a bump on a wafer is buried; flattening a surface of the bump and a surface of the adhesive layer through cutting processing using a cutting tool so that the surface of the bump and the surface of the adhesive layer become continuously flat; forming an easy-to-peel resin layer on the surface-flattened bump and adhesive layer; obtaining a semiconductor chip with the easy-to-peel resin layer by dicing the wafer having the easy-to-peel resin layer; picking up the semiconductor chip having the easy-to-peel resin layer; and peeling the easy-to-peel resin layer from the semiconductor chip having the easy-to-peel resin layer. COPYRIGHT: (C)2011,JPO&INPIT |
