发明名称 |
Tantalum CMP compositions and methods |
摘要 |
A composition suitable for tantalum chemical-mechanical polishing (CMP) comprises about 0.1 to about 10 percent by weight of a zirconia or fumed alumina abrasive, about 0.1 to about 10 percent by weight of an alkali metal iodate salt and an aqueous carrier. The composition has a pH of at least about 10. The composition is utilized to polish a surface of a tantalum-containing substrate.
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申请公布号 |
US7998228(B2) |
申请公布日期 |
2011.08.16 |
申请号 |
US20060489054 |
申请日期 |
2006.07.19 |
申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
LI SHOUTIAN |
分类号 |
B24D3/02;C09C1/68;C09G1/02;C09K3/14 |
主分类号 |
B24D3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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