| 摘要 |
PURPOSE: A semiconductor package is provided to easily manufacture a semiconductor package with resistance inside and improve reliability. CONSTITUTION: A substrate body(110) includes a lower side which faces to an upper side. A first connection pad is formed in the upper side. A second connection pad(130) is formed by being separated from the first connection pad on the upper side. A first bonding pad and a second bonding pad are formed in a semiconductor chip(200). A connecting member connects the first connection pad and the first bonding pad. A resistance member(500) connects the second connection pad and the second bonding pad. |
