| 摘要 |
<p>Disclosed is a switching device (10) provided with a plurality of differential switches (SW1, SW2, ...) formed on a semiconductor substrate (SUB). Each of the differential switches (SW1, SW2, ...) includes differential transistors (T1, T2). The differential switches (SW1, SW2, ...) are disposed on the semiconductor substrate (SUB) so that the differential transistors (T1) are adjacent to each other, and the differential transistors (T2) are adjacent to each other.</p> |
