| 摘要 |
<p>PURPOSE: A power module and a fabricating method the same are provided to improve heat dissipation by forming a base substrate with a plurality of anode oxide substrates and decreasing the bending of the base substrate. CONSTITUTION: In a power module and a fabricating method the same comprise: a base substrate(110) including a metal layer, an anode oxide layer, and a plurality of anode oxide substrate; a first adhesive(115) which is formed between the plural anode oxide substrates; and a high power chip and a low power chip(120,121) which are formed in the anode oxide substrate and are electrically connected to a circuit layer.</p> |
