| 摘要 |
<p>A sensor chip (I) has a carrier surface of metal oxide or semi-metal oxide, to which a homogeneous multilayer of polysiloxane has been applied by centrifugal, blade, spray, brush or dip coating. <??>An Independent claim is included for apparatus for dip-coating a sensor chip as in (I), comprising a holder with several open slits for receiving correspondingly dimensioned carriers (the size of the slits preferably being such that the narrowest upper side of the object carrier can be accommodated).</p> |
