发明名称 |
TWO-PART THERMOCURABLE POLYIMIDE RESIN COMPOSITION AND CURED PRODUCT THEREOF |
摘要 |
<p>It relates to a highly heat resistant thermosetting polyimide resin composition that is cured at a temperature of 150°C or less, and provides a cured product that generates a less amount of decomposed gas even under heating to 250°C, and has flexibility and adhesiveness. A two-component thermosetting polyimide resin composition containing a liquid A containing a polyimide (a) having a main chain constituted by a repeating unit having a polyoxyalkylenediamine structure with amino groups on both ends thereof, and a liquid B containing a bismaleimide compound, and a cured product of a thermosetting polyimide resin composition obtained by mixing these two liquids and curing the mixture under heating.</p> |
申请公布号 |
EP2070987(A4) |
申请公布日期 |
2011.08.10 |
申请号 |
EP20070829112 |
申请日期 |
2007.10.03 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
OHKIDO, MASAHITO;UENO, WATARU;OISHI, JITSUO;KIHARA, SHUTA |
分类号 |
C08L79/08;C08G73/00;C08G73/10;C08K5/00;C08K5/3415;C08L79/00 |
主分类号 |
C08L79/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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