High-frequency switch in multi-layer substrate

摘要

A switch module consists of a build-up multi-layer structure and some passive devices. The build-up multi-layer structure has multitudes of conductive layers and dielectric layers laminated upon each another. At least one dielectric layer is interfered between any two conductive layers. Any one passive device is a portion of at least one conductive layer and electrically connects multitudes of conductive pads on the surface of the build-up multi-layer structure.