| 摘要 |
<p>PURPOSE: A wafer absorption method using a robot arm including a pressure sensor is provided to prevent air gap generation between a vacuum absorption part and wafer by determining the wafer adhering in the vacuum absorption part using the pressure sensor included near the vacuum absorption part, thereby enabling to safely pick up the wafer in a shipping box by vacuum absorption. CONSTITUTION: A first pressure value is detected from a first pressure senor comprised near a first vacuum absorption part located in the middle of tweezers by vertically elevating an robot arm in a shipping box from the lower side of a wafer which is to be transported(S10,S20). A second pressure value is detected from a second pressure senor comprised near a second vacuum absorption part located in one end side of the tweezers by vertically elevating the robot arm when the first pressure value is detected. A third pressure value is detected from a third pressure senor comprised near a third vacuum absorption part located in the other end side of the tweezers. A fourth pressure value is detected from a fourth pressure senor comprised near a fourth vacuum absorption part located on vertex comprising an equilateral triangle with the third vacuum absorption part and second vacuum absorption part. The wafer is vacuum absorbed by recognizing wafers which are closely attached to each vacuum absorption part when a signal including the second, third, and fourth pressure value is inputted to a control part of a robot.</p> |
