发明名称 |
FABRICATION SYSTEM |
摘要 |
The present invention provides a vapor deposition system for a film forming systems that promote an efficiency of utilizing an EL material and is excellent in uniformity or throughput of forming an EL layer and a vapor deposition method. According to the present invention, vapor deposition is carried out in a deposition chamber by moving an evaporation source holder 903 on which six containers 911 filled with an evaporation material are set at a certain pitch with respect to the substrate. The evaporation holder 903 is transported from an installation chamber 905 by a transport mechanism 902 b. A heater is provided in a turntable 907 . Throughput can be improved by heating the evaporation holder 903 in advance of transporting containers into the evaporation holder 903. |
申请公布号 |
KR20110089200(A) |
申请公布日期 |
2011.08.04 |
申请号 |
KR20117014531 |
申请日期 |
2003.08.29 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
YAMAZAKI SHUNPEI;MURAKAMI MASAKAZU;KUWABARA HIDEAKI |
分类号 |
H01L51/52;C23C14/12;C23C14/22;C23C14/24;C23C14/54;C23C14/56;H01L27/32;H01L51/40;H01L51/50;H01L51/56;H05B33/04;H05B33/10;H05B33/14 |
主分类号 |
H01L51/52 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|