发明名称 |
COPPER ALLOY WITH HIGH STRENGTH AND HIGH ELECTRICAL CONDUCTIVITY |
摘要 |
Disclosed is a copper alloy with high strength and high electrical conductivity, which contains more than 1.0% by mass but less than 4% by mass of Mg and more than 0.1% by mass but less than 5% by mass of Sn with the balance made up of Cu and unavoidable impurities. The copper alloy with high strength and high electrical conductivity has a mass ratio of the Mg content to the Sn content, namely Mg/Sn of not less than 0.4. The copper alloy with high strength and high electrical conductivity may additionally contain more than 0.1% by mass but less than 7% by mass of Ni. |
申请公布号 |
WO2011093114(A1) |
申请公布日期 |
2011.08.04 |
申请号 |
WO2011JP50103 |
申请日期 |
2011.01.06 |
申请人 |
MITSUBISHI MATERIALS CORPORATION;MAKI KAZUNARI;ITO YUKI |
发明人 |
MAKI KAZUNARI;ITO YUKI |
分类号 |
C22C9/00;C22C9/01;C22C9/02;C22C9/04;C22C9/05;C22F1/00;C22F1/02;C22F1/08;H01B1/02 |
主分类号 |
C22C9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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