| 摘要 |
To provide a substrate for mounting element having sulfurization resistance improved by increasing planarity of the surface of a thick conductor layer. The substrate 10 for mounting element of the present invention has such a structure that on a surface of a LTCC substrate or ceramics substrate as an inorganic insulating substrate 1, a thick conductor layer 2 is formed as an element connection terminal. The thick conductor layer 2 is made of a metal composed mainly of silver (Ag) or copper (Cu) and formed by printing and firing a metal paste. This thick conductor layer has its surface planarized by wet blast treatment to a surface roughness Ra of at most 0.02μm. A Ni/Au-plated layer 3 is formed on the thick conductor layer 2, so that the surface of the thick conductor layer 2 is completely covered without any space.
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