Layer arrangement being thermally conductive and electrically isolating
摘要
The present disclosure relates to a device for thermally cooling while electrically insulating. The device contains a first adhesive layer, polyimide substrate, a second adhesive layer and a heat sink. The first adhesive layer and the second adhesive layer are a vinyl or acrylic polymer. The polyimide substrate has at least two polyimide layers. The polyimide layers are derived from at least one aromatic dianhydride and at least one aromatic diamine. The adhesive layers and the polyimide layers may contain thermally conductive fillers, light absorbing pigments or mixtures of both.
申请公布号
EP2124262(A3)
申请公布日期
2011.08.03
申请号
EP20090154160
申请日期
2009.03.02
申请人
E. I. DU PONT DE NEMOURS AND COMPANY
发明人
AUMAN, BRIAN, C.;HAEGER, CARL;LACOURT, PHILIP ROLAND;MCALEES, MARK ELLIOTT;MERITT, STANLEY DUANE;PREJEAN, GEORGE WYATT;TATE, HARLAND LEE