| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a gas barrier film in which adhesion between a base material and a gas barrier layer is improved more remarkably than the conventional case at high productive efficiency. <P>SOLUTION: In the method for producing a gas barrier film, a gas barrier layer is formed on a continuously running base material 10. The production method includes: a step of forming an intermediate adhesive layer with a thickness of≥3 mm on the surface of a base material 10 by a plasma chemical vapor deposition method according to a means of, using an RIE (Reactive Ion Etching) treatment apparatus provided with a metal roll electrode 1 and a grounding electrode 2 as a circular counter electrode along the same, introducing one or more kinds of gases at least including a gas for oxidation and a vaporized organic silicon compound into a space between both the electrodes 1, 2 and a means of controlling the pressure in a treatment space to 3 to 35 Pa, controlling power supply frequency to the high frequency of 30 kHz to 4 MHz and generating plasma between both the electrodes 1, 2; and a step of forming a gas barrier layer on the surface of the intermediate adhesive layer by a vacuum deposition process. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
