发明名称 Semiconductor device having superior resistance to moisture
摘要 In a semiconductor device, a circuit unit is formed in an inside portion, and seal rings that enclose the inside portion that are composed of walls of metal layers are formed around the periphery. In the corners, the seal rings include linear parts that extend inwardly in addition to the linear parts that extend along the periphery, whereby the seal rings are formed in a planar pattern having small rectangular planar patterns in each corner.
申请公布号 US6876064(B2) 申请公布日期 2005.04.05
申请号 US20040753326 申请日期 2004.01.09
申请人 NEC ELECTRONICS CORPORATION 发明人 MATUMOTO AKIRA;FUKASE TADASHI;IGUCHI MANABU;KOMURO MASAHIRO
分类号 H01L23/52;H01L21/3205;H01L21/82;H01L21/822;H01L23/00;H01L23/28;H01L27/04;(IPC1-7):H01L23/58 主分类号 H01L23/52
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