| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition excellent in thermal conductivity and insulating properties, particularly a resin composition suitably used as a radiating member for electronic parts. <P>SOLUTION: The resin composition comprises 60-73 vol.% thermally conductive filler of a hexagonal boron nitride agglomerated powder having an average particle diameter of 20-60 μm and an orientation index of 2-20 and an aluminum oxide powder having an average particle diameter of 0.1-1 μm and 27-40 vol.% silicone resin. The silicone resin is an organopolysiloxane having a vinyl group having a weight average molecular weight of 15,000-30,000 and a vinyl group having a weight average molecular weight of 400,000-600,000 and the volume ratio thereof is preferably 7:3 to 5:5. <P>COPYRIGHT: (C)2011,JPO&INPIT |
