| 摘要 |
PROBLEM TO BE SOLVED: To provide a division method of a substrate, capable of making a chip profile approximating a rectangle with improved reproducibility for dividing the substrate without chip breakage, and of forming a flat cleavage surface with improved reproducibility. SOLUTION: A substrate surface 2 is irradiated with an electron beam 1 and has intensity for generating dislocation inside the substrate, and a range that is longer than the depth from the substrate surface 2 at the interface of two parts having different temperatures, in which a crystal defect begins to be generated in the depthwise direction of the substrate; and cracks with dislocation as a starting point are generated and form a cleavage plane 5, and the substrate is divided. COPYRIGHT: (C)2011,JPO&INPIT |
