| 摘要 |
PROBLEM TO BE SOLVED: To provide an aligner improving throughput. SOLUTION: The aligner 1 includes: a stocker 3; an alignment mechanism 4; and a lifting mechanism 5. The stocker 3 has 25 pairs of supports 14, 14. One pair of supports 14, 14 supports a wafer 2. The pairs of supports 14, 14 are vertically arranged side by side so that wafers 2 are aligned vertically. The stocker 3 allows the pairs of supports 14, 14 to support the wafers 2 to stock the plurality of wafers 2. The alignment mechanism 4 adjusts the positions of the wafers 2 stocked this way. The lifting mechanism 5 lifts up or down the alignment mechanism 4 to a wafer 2 to be aligned. COPYRIGHT: (C)2011,JPO&INPIT |
