发明名称 Method for fabrication of a semiconductor device and structure
摘要 A semiconductor device comprising: a first single crystal silicon layer comprising first transistors, first alignment marks, and at least one metal layer overlying the first single crystal silicon layer, wherein the at least one metal layer comprises copper or aluminum more than other materials; and a second single crystal silicon layer overlying the at least one metal layers; wherein the second single crystal silicon layer comprises a plurality of second transistors arranged in substantially parallel bands wherein each of a plurality of the bands comprises a portion of the second transistors along an axis in a repeating pattern.
申请公布号 US7986042(B2) 申请公布日期 2011.07.26
申请号 US20100849272 申请日期 2010.08.03
申请人 MONOLITHIC 3D INC. 发明人 OR-BACH ZVI;CRONQUIST BRIAN;BEINGLASS ISRAEL;DE JONG JAN LODEWIJK;SEKAR DEEPAK C.
分类号 H01L23/58;H01L21/98;H01L23/528 主分类号 H01L23/58
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