发明名称 |
CTE-MATCHED HEAT PIPE |
摘要 |
Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.
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申请公布号 |
US2011176276(A1) |
申请公布日期 |
2011.07.21 |
申请号 |
US201113074987 |
申请日期 |
2011.03.29 |
申请人 |
SARRAF DAVID;HARTENSTINE JOHN;TOTH JEROME;GARNER SCOTT |
发明人 |
SARRAF DAVID;HARTENSTINE JOHN;TOTH JEROME;GARNER SCOTT |
分类号 |
H05K7/20;F28D15/02;F28D15/04;F28F7/00;H01L23/427 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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