SUBSTRATE WITH INTEGRATED FINS AND METHOD OF MANUFACTURING SUBSTRATE WITH INTEGRATED FINS

摘要

Disclosed is method of manufacturing substrates with integrated fins that alleviates warping of a metallic base plate and deformation of radiator fins, i.e., the occurrence of flix, etc., thereupon. The bonding of metallic circuit boards (15) with ceramic substrates (10) is carried out by liquid metal bonding. The shaping of a plurality of radiator fins (20a), which are to be cut out upon a portion of a metallic base plate (20), is caused by anchoring with a tool so as to apply stress tension upon the face whereupon the cut out portion radiator fins (20a) are formed, and carrying out a channel insertion process that forms a plurality of channels (25), by moving a multi-cutter, whereupon is layered a plurality of circular cutters, upon the face whereupon the stress tension has been applied, while rotating same.