| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting diode wherein a semiconductor chip mounted using a metal lead frame is sealed with a thermoplastic resin comprising a specific cyclic hydrocarbon polymer. SOLUTION: The light-emitting diode is excellent in heat-resistance, heat cycle characteristic, light transmission characteristic, long-term reliability, and adhesion between a sealing resin and a lead frame. |
