LED ARRAY MODULE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: An LED array module and a manufacturing method are provided to enhance a radiation effect by using a solder layer with an excellent thermal conductivity. CONSTITUTION: A heat dissipation slug(108) is attached to an LED and its bottom. One or more LED unit modules(100) includes a lead respectively connected to a cathode and an anode of the LED. A metal thick film is arranged to an upper side of the heat dissipating plate in a downward direction of the heat dissipation slug. The first solder layer(106) is arranged between the upper side of the metal thick film and a bottom surface of the heat dissipation slug. The first insulation layer is formed in the upper side of the heat dissipation plate and an area except a junction side between the upper side of the heat dissipation plate and the metal thick film layer.