| 摘要 |
<p>A semiconductor module (1) is provided with an upper arm (2) and a lower arm (3) of an inverter circuit. The upper arm (2) has a switching element (5A) and a rectifying element (6A), and the lower arm (3) has a switching element (5B) and a rectifying element (6B). The upper arm (2) and the lower arm (3) are stacked such that the switching elements (5A, 5B) overlap each other and that the rectifying elements (6A, 6B) also overlap each other. A cooling medium channel (21) which constitutes a cooling section extends along both the sides in the direction wherein the switching elements (5A, 5B) are stacked and the rectifying elements (6A, 6B) are stacked, and the channel is folded on the side of the rectifying element stacked section (1B).</p> |
