摘要 |
A novel design and method for manufacturing camera modules is disclosed. The camera module includes a flexible circuit substrate, an image capture device flip-chip mounted to the bottom surface of the flexible circuit substrate, a housing mounted over the top surface of the flexible circuit substrate, and a lens unit coupled to the housing. In an example embodiment, the camera module includes a stiffener formed directly over a plurality of electrical components mounted on the top surface of the flexible circuit substrate. In another example embodiment, the bottom surface of the flexible circuit substrate defines a recessed portion whereon the image capture device is flip-chi mounted. A disclosed method for manufacturing camera modules includes providing a flexible circuit tape having a plurality of discrete circuit regions, providing a plurality of image capture devices, flip-chip mounting each image capture device on an associate one of the discrete circuit regions. |
申请人 |
FLEXTRONICS AP LLC;TAM, SAMUEL, WAISING;PUN, TAI, WAI (DAVID);PANG, TAK, SHING (DICK) |
发明人 |
TAM, SAMUEL, WAISING;PUN, TAI, WAI (DAVID);PANG, TAK, SHING (DICK) |