| 摘要 |
<p>PURPOSE: An adhesive composition is provided to maintain properties such as adhesive property, heat resistance, fire retardancy, and bleed-out resistance and to improve adhesive property using organic particles as a filler. CONSTITUTION: A halogen-free adhesive composition for a coverlay film comprises (a) 100 parts by weight of a non-halogen based epoxy resin, (b) 50-250 parts by weight of a carboxyl group-containing acrylonitrile-butadiene rubber, (c) 1-25 parts by weight of at least one or more hardeners selected from amine-, acid anhydride-, or phenol-based resins, (d) 0.05-0.5 parts by weight of one curing accelerator selected from imidazole-, phosphine-, or fluorinated boron metal compounds, (e) 5-60 parts by weight of a single or mixed non-halogen organic flame retardant selected from phosphorous, melamine, or phosphagen, and (f) 10-100.0 parts by weight of filler consisting of organic particles.</p> |
