| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a bubble defect from occurring without causing a decrease in productivity in a process of exposing a resist film. <P>SOLUTION: In the process of exposing the resist film 4a, exposure is carried out in a state wherein a diameter that an inner air knife 8 has at a forward half-circumference part in a scanning direction of exposure light is made smaller than a diameter that an outer air knife 9 has at a rearward half-circumference part while a liquid film 17 is held on the resist film 4a by using one of a forward half-circumference part and a rearward half-circumference part, in the scanning direction of the exposure light, of each of two kinds of the inner air knife 8 and outer air knife 9 centered in the center of the liquid film 17 and differing in diameter. <P>COPYRIGHT: (C)2011,JPO&INPIT |
