| 摘要 |
PURPOSE: A method for manufacturing an image sensor is provided to reduce heat applied to a wiring layer by thermally processing a photo diode through the lower side of a substrate. CONSTITUTION: A photo diode(110) is formed on the upper side(101) of a substrate(100). A wiring layer is formed on the substrate. Heat is applied to the photo diode through the lower side of the substrate. A heat source of 800 to 1500 degrees centigrade is arranged on the lower side of the substrate.
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