发明名称 |
LED INTERCONNECT ASSEMBLY |
摘要 |
A light-emitting device assembly which can be used in many applications has a contact carrier, at least one light-emitting device, a heat sink and at least one securing member. The contact carrier has a light-emitting device receiving region and resilient contacts which are provided proximate to the light-emitting device receiving region. The at least one light-emitting device has leads which extend therefrom to mechanically and electrically engage the resilient contacts. The heat sink is thermally coupled to the at least one light-emitting device. The at least one securing member extends through the contact carrier and into the heat sink to releasably retain the contact carrier and the at least one light-emitting device in position relative to each other and relative to the heat sink. |
申请公布号 |
EP2340393(A1) |
申请公布日期 |
2011.07.06 |
申请号 |
EP20090789345 |
申请日期 |
2009.09.21 |
申请人 |
TYCO ELECTRONICS CORPORATION |
发明人 |
GINGRICH, CHARLES, RAYMOND, III |
分类号 |
F21V19/00;F21K9/00;F21Y115/10;H01R13/24;H01R13/717 |
主分类号 |
F21V19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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