发明名称 LED INTERCONNECT ASSEMBLY
摘要 A light-emitting device assembly which can be used in many applications has a contact carrier, at least one light-emitting device, a heat sink and at least one securing member. The contact carrier has a light-emitting device receiving region and resilient contacts which are provided proximate to the light-emitting device receiving region. The at least one light-emitting device has leads which extend therefrom to mechanically and electrically engage the resilient contacts. The heat sink is thermally coupled to the at least one light-emitting device. The at least one securing member extends through the contact carrier and into the heat sink to releasably retain the contact carrier and the at least one light-emitting device in position relative to each other and relative to the heat sink.
申请公布号 EP2340393(A1) 申请公布日期 2011.07.06
申请号 EP20090789345 申请日期 2009.09.21
申请人 TYCO ELECTRONICS CORPORATION 发明人 GINGRICH, CHARLES, RAYMOND, III
分类号 F21V19/00;F21K9/00;F21Y115/10;H01R13/24;H01R13/717 主分类号 F21V19/00
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