发明名称 |
SEMICONDUCTOR LIGHT-EMITTING DEVICE MOUNTING MEMBER, LIGHT-EMITTING DIODE CONSTITUTING MEMBER USING SAME, AND LIGHT-EMITTING DIODE USING SAME |
摘要 |
A semiconductor-light-emitting-device-mounting member BL comprises (a) a highly heat-dissipative member 1 having a main surface 10 on which connecting-use electrode layers 41 and 42 are provided to form a device-mounting area 10a and (b) a frame-shaped member 2 placed on the main surface 10 so as to surround the device-mounting area 10a. The device-mounting area 10a has an area that is 1.05 to 4 times the area of a semiconductor light-emitting device LE1. A light-emitting-diode-constituting member LE2 mounts a semiconductor light-emitting device LE1 on the device-mounting area 10a of the semiconductor-light-emitting-device-mounting member BL and has a fluorescent body and/or a protective resin LR filling the inside space of the frame-shaped member 2. A light-emitting diode LE3 mounts the light-emitting-diode-constituting member LE2 on a package 7. |
申请公布号 |
EP1659642(A4) |
申请公布日期 |
2011.07.06 |
申请号 |
EP20040772094 |
申请日期 |
2004.08.18 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
HIGAKI, K.;ISHIDU, S.;AMOH, T.;TSUZUKI, Y. |
分类号 |
H01L33/00;H01L33/50;H01L33/56;H01L33/58;H01L33/62;H01L33/64 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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