| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wafer dividing device correctly, reliably and efficiently dividing, along streets, a wafer reduced in strength along the streets, and to provide a laser beam machine equipped with the same. <P>SOLUTION: The wafer dividing device that divides, along the plurality of streets, the wafer which adheres to an upper surface of a dicing tape mounted onto an annular frame and reduced in strength along the plurality of streets formed in a lattice includes: a frame holding means holding the annular frame; a wafer holding table having a holding surface for holding the wafer via the dicing tape mounted onto the annular frame held by the frame holding means; a tape expanding means for relatively moving the frame holding means and the wafer holding table in a vertical direction to the holding surface to expand the dicing tape; and a vibration generating means exerting vibration on the holding surface of the wafer holding table. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
