| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame improving adhesion between a semiconductor element mounting member and a lead part, and solder by increasing contact areas between the semiconductor element mounting member and the lead part, and the solder, and a method for manufacturing the lead frame, and to provide a semiconductor device and a method for manufacturing the semiconductor device. SOLUTION: A lead frame 10 includes: a semiconductor element mounting member 11 mounting a semiconductor element 21; and a lead part 12 provided around the semiconductor element mounting member 11 and electrically connected with the semiconductor element 21. A plating member 14 for wiring is formed on an outer surface 11b of the semiconductor element mounting member 11, and a plating member 15 for wiring is formed on an outer surface 12b of the lead part 12. Furthermore, the plating members 14 and 15 are also formed on a part of side surfaces 11c, 11d, 12c and 12d connected with the outer surfaces 11b and 12b. COPYRIGHT: (C)2011,JPO&INPIT |
