MICROELECTROMECHANICAL TRANSDUCER AND CORRESPONDING ASSEMBLY PROCESS

摘要

A MEMS transducer (1) has a micromechanical sensing structure (10) and a package (46). The package (46) is provided with a substrate (45), carrying first electrical-connection elements (47), and with a lid (25), coupled to the substrate to define an internal cavity (24), in which the micromechanical sensing structure (10) is housed. The lid (25) is formed by: a cap layer (20) having a first surface (20a) and a second surface (20b), set opposite to one another, the first surface (20a) defining an external face of the package (46) and the second surface (20b) facing the substrate (45) inside the package (46); and a wall structure (21), set between the cap layer (20) and the substrate (45), and having a coupling face (21a) coupled to the substrate (45). At least a first electrical component (10, 11) is coupled to the second surface (20b) of the cap layer (20), inside the package (46), and the coupling face (21a) of the wall structure (21) carries second electrical-connection elements (30), electrically connected to the first electrical component (10, 11) and to the first electrical-connection elements (47).