发明名称 CHIP RESISTER AND METHOD OF MANUFACTURING THE SAME
摘要 PURPOSE: A chip resistor and a manufacturing method thereof are provided to reduce a resistance error in a PCB bonding process by including a heat radiation substrate made of metal. CONSTITUTION: A heat radiation substrate is made of metal. An insulation layer(120) covers the outer side of the heat radiation substrate. A resistor(130) is arranged on the insulation layer corresponding to the lower side of the heat radiation substrate. A pair of electrodes(150) are arranged on both lower sides of the resistor with a space. A protection member(160) covers the space formed on the lower side of the resistor.
申请公布号 KR20110073765(A) 申请公布日期 2011.06.30
申请号 KR20090130501 申请日期 2009.12.24
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, YOUNG KEY;PARK, JANG HO;SUH, KI WON;KIM, SUNG JUN;RYU, HEUNG BOK
分类号 H01C1/084;H01C1/02 主分类号 H01C1/084
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