CHIP RESISTER AND METHOD OF MANUFACTURING THE SAME
摘要
PURPOSE: A chip resistor and a manufacturing method thereof are provided to reduce a resistance error in a PCB bonding process by including a heat radiation substrate made of metal. CONSTITUTION: A heat radiation substrate is made of metal. An insulation layer(120) covers the outer side of the heat radiation substrate. A resistor(130) is arranged on the insulation layer corresponding to the lower side of the heat radiation substrate. A pair of electrodes(150) are arranged on both lower sides of the resistor with a space. A protection member(160) covers the space formed on the lower side of the resistor.
申请公布号
KR20110073765(A)
申请公布日期
2011.06.30
申请号
KR20090130501
申请日期
2009.12.24
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
KIM, YOUNG KEY;PARK, JANG HO;SUH, KI WON;KIM, SUNG JUN;RYU, HEUNG BOK