| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for reducing process time without causing a micro-crack for forming a through-hole on a laminated substrate. <P>SOLUTION: A method of manufacturing a piezoelectric device includes the steps of: bonding a first substrate 11 on a second substrate 21 having higher toughness than that of the first substrate 11; forming a first through-hole 12 on the first substrate 11, from a side opposite to the side bonded to the second substrate 21; and forming a second through-hole 22 on the second substrate 21, at a position corresponding to the first through-hole 12 from a side opposite to the side bonded to the first substrate 11 in accordance with a formation method different from that of the first through-hole 12. <P>COPYRIGHT: (C)2011,JPO&INPIT |
