| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of producing an Sn plating material capable of maintaining the thickness of an Sn plating layer over a long period and suppressing the deterioration of solder wetness of the plating material by retarding alloying of Sn with base plating metal and the growth speed of the alloy layer more slowly than heretofore without increase in production cost. <P>SOLUTION: The plating material is constituted so that a base plating layer made of Cu or Cu alloy is formed on a substrate made of Cu or Cu alloy and a surface plating layer made of Sn or Sn alloy is further formed on the base plating layer, and a Cu and Sn alloy layer is formed between the base plating layer and the surface plating layer by further performing thermal treatment, wherein a thickness of the base plating layer is 0.5 to 2.0μm, a thickness of the surface plating layer is 0.5 to 3.0μm, a thickness of the Cu and Sn alloy layer is 0.8 to 2.0μm and further an average particle size of Cu and Sn alloy is 4 to 10μm. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
