| 摘要 |
<p>A target and backing plate assembly for magnetron sputtering includes a target, the distance between the erosion surface of the target and a magnet disposed at the rear surface of the target and that between the erosion surface and a surface of a substrate facing the target being fixed. The target has an uneven shape of which thickness is changed at a surface adjacent to a backing plate such that portions to be eroded by sputtering are thick. Conductive spacers are disposed between the backing plate and the target having the uneven shape at thin portions of the target. With this structure, a target of which lifetime and use efficiency are increased while film uniformity (uniformity of film thickness) is kept excellent throughout the sputtering life of the target can be provided. In addition, a method of manufacturing the target and a target backing plate can be provided.</p> |
