Method for producing a substrate for use in semiconductor processing

摘要

The present invention is related to a method for manufacturing a substrate suitable for use in semiconductor processing. According to the invention, a substrate is constructed from a smaller sized substrate (1) and a larger sized substrate (2), the larger sized substrate comprising an opening large enough to accommodate the smaller sized substrate. According to the method, both substrates are permanently attached to a carrier (7), which can optionally be thinned so as to have the right dimensions for being handled by semiconductor processing equipment designed for said larger size. The larger substrate therefore does not play the role of a holder for the smaller substrate, but both substrates are assembled to form a new substrate, which can be handled as such. The invention is equally related to such a new substrate, which is obtainable by the methods of the invention.