| 摘要 |
PROBLEM TO BE SOLVED: To prevent imperfect wire bonding to inner leads of main circuit terminals which are subjected to insert molding on an enveloping case, by improving the shape of an adhesive agent spreading trench on a bottom surface of the case bonded to a metal base. SOLUTION: In a package structure, the metal base 1 mounting a power circuit is bonded to the bottom surface of the enveloping case 2 which is collectively formed integrally with terminals, and wire bonding is performed by an ultrasonic compression bonding method on parts between the inner leads 4a of the main circuit terminals 4 which are subjected to insert molding on the case 2, and the power circuit. In the structure, corresponding to parts in which at least the inner leads of the main circuit terminals overlap vertically with inner leads of other terminals, a trench width enlarging part 2b wherein trench width is enlarged partially toward the lower surface regions of the inner leads is formed in a recessed trench 2a which is formed on the bottom surface of the case 2 and used for spreading adhesive agent. The lower surface region of the inner leads 4a is bonded perfectly to the metal base 1, so that ultrasonic bonding of wires is stabilized. |
