| 摘要 |
PURPOSE: A substrate plating apparatus is provided to make electrolyte between a target and a substrate into a turbulent flow to thereby improve metal ion transfer effect through the electrolyte. CONSTITUTION: A substrate plating apparatus comprises a chamber(10), a target(20), an electrolyte supply source(30), and a turbulent flow induction part(40). The chamber accepts electrolyte. The chamber selectively dips a substrate connected to a cathode. The target is dipped in the electrolyte. The target generates metallic ions when a positive voltage applied thereto. The electrolyte supply source supplies the electrolyte to the chamber. The turbulent flow induction part makes the electrolyte into a turbulent flow in the chamber.
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