发明名称 Method of implantation
摘要 Provided is a method of implanting dopant ions to an integrated circuit. The method includes forming a first pixel and a second pixel in a substrate, forming an etch stop layer over the substrate, forming a hard mask layer over the etch stop layer, patterning the hard mask layer to include an opening between the first pixel and the second pixel, and implanting a plurality of dopants through the opening to form an isolation feature.
申请公布号 US7968424(B2) 申请公布日期 2011.06.28
申请号 US20090355211 申请日期 2009.01.16
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 LIN JENG-SHYAN;YAUNG DUN-NIAN;LIU JEN-CHENG;CHUANG CHUN-CHIEH;CHEN PAO-TUNG;WANG WEN-DE;HUNG JYH-MING
分类号 H01L21/76 主分类号 H01L21/76
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