| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroplating apparatus which can more uniformly form a plated film on the surface of an article to be plated in comparison with a conventional one, and to provide an electroplating method. SOLUTION: The electroplating apparatus has a negative electrode 7 in a lower face side and a rotating portion 8 in an upper face side in a plating tank and an uneven surface 7a is formed on the top face of the negative electrode 7. The electroplating apparatus also sandwiches the article 12 to be plated between the negative electrode 7 and the rotating portion 8, and supplies an electric current between a cathode and an anode to form the plated film on the surface of the article 12 to be plated. At this time, the rotating portion 8 is rotatably supported. The top surface of a salient of the uneven surface 7a is formed of a curved surface. COPYRIGHT: (C)2011,JPO&INPIT
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