发明名称 NON-BONDED ROTATABLE TARGET FOR SPUTTERING
摘要 PROBLEM TO BE SOLVED: To provide a target assembly improved regarding the exchange caused by the damage of a target assembly leading to remarkable cost increase and reduction in its performance. SOLUTION: A rotatable target for sputtering is described. This target includes a target backing tube 205 having an exterior surface; a backing layer in contact with the exterior surface of the target baking tube 205, the backing layer being electrically conductive and thermally non-conductive; and a plurality of target cylinders located around the target backing tube 205 and in contact with the backing layer. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011117078(A) 申请公布日期 2011.06.16
申请号 JP20100242230 申请日期 2010.10.28
申请人 APPLIED MATERIALS INC 发明人 NEWCOMB RICHARD;ROBINSON DOUG
分类号 C23C14/34 主分类号 C23C14/34
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