HEAT-RESISTANT ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE FABRICATION, ADHESIVE USED FOR THE SHEET, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SHEET

摘要

The present invention provides a heat-resistant adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer contains a rubber component and an epoxy resin component. The proportion of the rubber component in an organic substance in the adhesive is in the range of 20 to 60 wt %.