| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component-embedded printed circuit board and a method of manufacturing the same that eliminates the need to form additional via holes and enhance the degree of freedom of circuit design. <P>SOLUTION: The electronic component-embedded printed circuit board includes: a base substrate 110 having a cavity 115 formed therein in a thickness direction thereof; an electronic component 120 which is disposed in the cavity 115 such that an active surface 123 is flush with one face of the base substrate 110; an insulating material 130 which is formed on the other face of the base substrate 110 to bury the electronic component 120; and a first circuit layer 140 which is formed on one face of the base substrate 110 and includes connection patterns 145 coming into contact with connecting terminals 125 of the electronic component 120. The electronic component-embedded printed circuit board is advantageous in that the active surface 123 of the electronic component 120 is disposed such that it is flush with one face of the base substrate 110, so that additional via holes do not need to be formed, with the result that a laser process requiring high cost can be omitted, thereby simplifying the manufacturing process and reducing the manufacturing cost thereof. <P>COPYRIGHT: (C)2011,JPO&INPIT |
